The under the 400 g within the

The thin cover of pure tin solder plating need less time for the motion of intermetallic compound to the pure tin grain boundaries plating to initiate the compressive stress 58. According to Horváth et.

al, the manipulation of the size of the pure tin grain will cause the adjustment in the rate of grain boundary dispersion and the level of exerted compressive stress.4.2.2.

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Effect of Temperature on the Pure Tin solder.There are two sample of pure Tin solder dip are placed under indentation of the same load about 200 g are placed at room temperature and at 150 for the period of 240 hours. For the first sample that indented under the 400 g within the room temperature, only several nodules are formed in comparison with the pure tin sample under indentation of 200 g in the 150 oC.